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2024
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01
The service life of solar panels
The service life of the solar panel is determined by the material of the panel, such as tempered glass, EVA, TPT, etc. Generally, the service life of solar panels produced by manufacturers with better materials can reach 25 years, but it is affected by environmental impact. Over time, the materials of solar panels will age. Generally, the power will drop by 30% after 20 years of use, and the power will drop by 70% after 25 years of use.
There are 10 steps of slicing, cleaning, suede preparation, peripheral etching, back P N junction removal, upper and lower electrode production, anti-reflection film production, sintering, testing and grading.
Solar cell specific manufacturing process description
(1) Slice: Use multi-wire cutting to cut the silicon rod into square silicon wafers.
(2) Cleaning: The silicon wafer is cleaned by regular cleaning method, and then the damaged layer on the surface of the silicon wafer is removed by 30-50um with acid (or alkali) solution.
(3) Preparation of textured surface: The silicon wafer was anisotropically etched by alkali solution, and the textured surface was prepared on the surface of the silicon wafer.
(4) phosphorus diffusion: the use of coating source (or liquid source, solid phosphorus nitride source) for diffusion, the formation of PN junction, junction depth is generally 0.3 to {{4}}. 5 well.
(5) Peripheral etching: The diffusion layer formed on the peripheral surface of the silicon wafer during diffusion can short-circuit the upper and lower electrodes of the battery, and the peripheral diffusion layer can be removed by mask wet etching or plasma dry etching.
(6) Remove the back PN junction. Wet etching or grinding is typically used to remove the back side PN junction.
(7) the upper and lower electrode production: the use of vacuum evaporation, chemical plating nickel or aluminum paste printing, sintering process. The lower electrode is made first, and then the upper electrode is made. Aluminum paste printing is a widely used process.
(8) Production of anti-reflection film: In order to reduce the loss of incident reflection, a layer of anti-reflection film should be covered on the surface of the silicon wafer. The anti-reflection film is made of MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5, etc. The process may be a vacuum coating method, an ion coating method, a sputtering method, a printing method, a PECVD method or a spraying method.
(9) Sintering: The battery chip is sintered onto a nickel or copper substrate.
(10) test classification: according to the specified parameter specifications, test classification.
More information
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